Quick Start Micro Training LLC

Microelectronics, Microsystems & Reliability Training

A More Effective, Efficient and Affordable Way to Acquire Critical Skills and Knowledge

 

- Click here for 1-hour narrated Overview of Microelectronics, Optoelectronics & MEMS or to see sample narrated modules from courses

 

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For a Brochure With Sample Slides Click Here

You can listen to a sample module on Realizing Reliability in both versions:

First, for the basic VERY Quick Start (VQS) Version click here

After listening to the VQS version,

for the supplemental Quick Start Version click here

INTEGRATED CIRCUIT RELIABILITY COURSE

Two Versions: VERY Quick Start and Quick Start

Available as Narrated E Learning, Webinar or In-House Formats

Dr. Ted Dellin

 

 

     Reliability is a critical concern for the manufacturers and users of products, including integrated circuits (ICs).  This course is designed to quickly and easily provide relevant information that will enable allow students to more successfully meet current and future reliability challenges.  No prior reliability knowledge is assumed.  The course focuses on four areas: describing reliability, reliability engineering, reliability physics and reliability management. The reliability description, management and engineering sections are quite general, and apply to a wide range of products, not just ICs. 

     An outline of the course modules is given below.  The Very Quick Start Version provides a one-day overview (7 ¼ hour Narrated Course). The Quick Start Version is not a stand alone course, but is a supplement to the Very Quick Start Version and provides additional material for persons who want more depth and breadth.  The course starts with describing reliability (definitions, reliability functions and bathtub curve).  Next, the reliability management sections focus on reliability program goals and how to meet them (building-in reliability, designing-in reliability, testing-in reliability, wafer level reliability).  The reliability engineering explains the distributions of times to failures, sampling/confidence limits and accelerated testing .  The reliability physics section focuses on the major CMOS IC failure modes (breakdown, hot carrier, NBTI, electromigration, voiding, SEU, packaging failure mechanisms) .

    This course as part of an integrated curriculum in microelectronics, optoelectronics, MEMS/Microsystems and reliability developed and are taught by Dr. Ted Dellin.  Dr. Dellin retired as Chief Scientist of the Microsystems Center at Sandia National Labs and led the development of the reliability section of the International Technology Roadmap for Semiconductors.  

  Module Topics

                                                                                                    Very Quick Start              Quick Start

1. Introduction                                                                          31 min.                                       X

2. Describing Reliability I: Definitions                                      24 min.                                      - - -

3. Describing Reliability II: Units                                              18 min.                                      X

4. Describing Reliability III: Bathtub Curve                              15 min.                                     X

5. System Reliability                                                                  14 min.                                      - - -

6. Goals of a Reliability Program                                              15 min.                                     X

7. Meeting the Reliability Challenge (Building-In Rel)            47 min.                                     X

8.  Developing a Reliability Program                                        16 min.                                     X

9. Dealing With Variability                                                        16 min.                                     X

10. Reliability Plotting                                                              16 min.                                      X

11. Confidence Limits                                                               33 min.                                      X

12. Which is the Correct Distribution?                                      - - -                                          X

13. True Accelerated Aging                                                      17 min.                                      X

14. Accelerated Aging Models                                                 15 min.                                      X

15. Qualification                                                                        40 min.                                      - - -

16. Brief review of transistors & ICs                                       34 min.                                      - - -

17. Time Dependent Dielectric Breakdown                           13 min.                                       X

18. Hot Carrier & NBTI Degradation                                       12 min.                                       X

19. Interconnect Failure Mechanisms                                   28 min.                                       X

20. Other Failure Mechanisms (ESD, SEU, …)                        11 min.                                      X

21. Package failure mechanisms                                             18 min.                                      X

22. Packaged IC Reliability Tests (Burn In)                             12. min.                                     X

 

(c)2004-09 Dellin, All Rights Reserved              Contact: dellin@ieee.org