|
Quick Start Micro Training LLC Microelectronics, Microsystems & Reliability Training A More Effective, Efficient and Affordable Way to Acquire Critical Skills and Knowledge
- SPECIAL: Affordable Courses at you site for unlimited students from $5,999 (1-day) to $13,999 (3-day) |
|
- Click here to Preview Selected Slides from the Course We can customize the content, level and length to meet your needs
Integrated Circuit Reliability Reliability Engineering, Management and Failure Mechanisms Dr. Ted Dellin
Reliability is a
critical concern for the manufacturers and users of products,
including integrated circuits (ICs).
Developing practical, affordable techniques to ensure
reliability has always been challenging.
It is even more
challenging as problems with scaling require the introduction of
new materials, new operating regions and the
reduction of reliability margins.
This course is
designed to provide relevant information that will enable allow
the attendees to more successfully
meet current and future reliability challenges.
The course focuses on three areas: reliability
engineering, reliability
physics and reliability management.
The reliability management and reliability engineering
sections are quite
general, and apply to a wide range of products, not just
ICs. The reliability
physics section focuses on the failure
mechanisms of ICs.
The reliability
management sections focus on reliability program goals and how
to meet them. A critical
review
is presented of the major approaches to reliability including
building-in reliability, designing-in reliability, testing-in
reliability, wafer level reliability and science-based
reliability (physics of failure).
Key strategies for a successful
reliability program are presented.
The reliability
engineering sections focus on realizing and assuring
reliability. The major
statistical
distributions (exponential, lognormal & Weibull) are considered,
including their areas of applicability, reliability
plotting and confidence limits.
The use of test structures, standard evaluation circuits
and real devices is reviewed.
Accelerated aging, qualification (knowledge-based vs. stress
based) and IC reliability tests, including burn-in, are
also considered.
The reliability
physics sections focus on the main on-chip and package failure
mechanisms of CMOS ICs.
The
transistor section will deal with time dependent dielectric
breakdown (including changes below 5nm), hot carrier
effects, and NBTI. The
interconnect section will consider electromigration (including
Cu vs. Al), stress voiding and
failures associated with the interlevel dielectrics (low k
dielectrics). Other
failure modes including ESD and single
event effects will be described.
Finally, failure mechanisms associated with packaging
will be presented.
The course is
suitable for engineers, managers, technicians and salespeople in
all aspects of ICs including
research, design, processing, test, failure analysis and
reliability. No prior
knowledge of reliability is assumed.
Some familiarity with IC technology might be useful, but not
mandatory.
Like all Quick Start Micro
Training courses, this seminar presents the most important
information in an efficient, easy-to-understand and entertaining
manner. Dr. Dellin has
over 25 years experience in microelectronics and microsystems.
He is the Chief Scientist Emeritus of the Microsystems
Center at Sandia and leads the development of the reliability
section of the International Technology Roadmap for
Semiconductors. Dr.
Dellin is also a member of Sematechs Relability Technical
Advisory Board. He has 10
years experience in teaching including developing Sandias
in-house microsystems university, university teaching, 5
tutorials at IRPS and presenting short courses for organizations
in the U.S. and Europe. The response of past students to our
courses has generally been very favorable.
Introduction
Describing
Reliability Qualitative (Reliability Definition Bathtub Curve, Yield &
Reliability)
Describing
Reliability Quantitative (4 basic reliability functions)
Goals of a
Reliability Program (How reliability adds value; customer requirements)
Building-in,
Designing-in & Physics of Failure (test structures; wafer level
reliability)
Developing
Reliability Engineering Program (pros and cons of different options)
Distributions
(Exponential, Weibull, Lognormal)
Reliability
Plotting
Dealing With
Variability (Which distribution? Confidence)
Accelerated Aging
("true" accelerated aging; acceleration models)
Reliability
Qualification (Stress-based & Knowledge-based)
Burn-In (Issues
with burn-in of advanced technologies)
Competitive
Reliability
Time Dependent
Dielectric Breakdown (thick & thin oxides)
Hot Carrier and
Negative Bias Temperature Instability
Interconnect (Al &
Cu) and Interlevel Dielectrics (with low k)
Other Mechanisms (ESD,
Single Event Effects, Radiation)
Packaging Failure
Mechanisms and Package Reliability Tests
|
|
(c)2004-07 Dellin, All Rights Reserved Contact: dellin@ieee.org |