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TO LISTEN TO A SAMPLE NARRATED MODULE ON MOS TRANSISTORS CLICK HERE
Very Quick Start(tm)
Microelectronics Course
Available as 7 1/4 Hour Narrated Course, 9 Hour Webinar or 1-Day In Person Course
If you develop or use CMOS integrated circuits it is important that you have a basic understanding of how these devices work and how they are built.
This unique course provides a quick easy-to-understand, intuitive approach to acquiring this knowledge. The only prerequisite is an introductory college physics course.
An outline of the course's 17 modules (along with the times of the narrated version) is presented below. The first part of the course is "how things work" starting with the properties of semiconductors through how MOS transistors work. The second part of the course is "how things are built". Following an overview this part of the course starts with the basic building blocks of processing and goes on the the process for making a CMOS IC and packaging the IC.
The course is designed for technicians, engineers, scientists, managers and technical salespeople.
Module Topics and Narration Time
1. Introduction 33 minutes
2. Review (Structure of atom, Current and Voltage, Scientific Notation) 36 minutes
3. Semiconductors Are Special (properties not found in metals; crystals) 28 minutes
4. Electrons and Holes (conduction & valance band, generation & recombination) 41 minutes
5. Doping (n and p type semiconductors) 32 minutes
6. Currents (Diffusion and drift) 10 minutes
7. pn Junction (charge layer, electric field, diffusion barrier) 20 minutes
8. Effect of voltage on pn junction (controls diffusion barrier, diode current vs. voltage) 22 minutes
9. Metal Oxide Semiconductor (MOS) Capacitor (Inversion, threshold voltage) 17 minutes
10. MOS Transistor (Structure, Current vs. Gate and Drain Voltages) 35 minutes
11. Integrated Circuits and Scaling (IC is transistors plus wiring, Scaling down)
12. Overview of Making an IC (technology development to packaging) 15 minutes
13. Design and Layout (Designing an IC; layout; design rules, test) 18 minutes
14. Unit Processes (Cleaning, lithography, CMP, Ion Implantation, Films, Etching) 25 minutes
15. Process Flow Front End of Line (blank wafer through transistors) 26 minutes
16. Process Flow Back End of Line (on-chip electrical connections) 21 minutes
17. Packaging (plastic encapsulated microcircuit; trends) 22 minutes
Total Time: 7 hours, 18 minutes